Features
1, reflow capabilities to meet environmental solder paste reflow conditions.
2, excellent heating material, digital temperature control and digital display table-time, stable and reliable temperature control .
3, the bottom of the aluminum alloy is heated, high temperature precision, small fluctuations, to eliminate damage to the BGA chip
4, can simultaneously welding BGA chip of different specifications .
Main Specifications
1, heating plate size : 1 2 0MM × 2 0 0MM
2, Power: 9 00W.
3, the set temperature: room temperature ~ 300 ℃ adjustable, PID temperature control.
4. Temperature control: K-type thermocouple, closed loop control
5, the working voltage: AC220V 50 / 60Hz .
6, Dimensions: 3 6 0MM × 30 × 1 0MM 50 MM (L × W × H)
7, Weight: about 8 Kg
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